Typical Use Physical Properties Contact Us
Product Description
Bonding agent or for the encapsulation of rigid electrical components, filleting, bonding and repair of printed circuit boards.
Additional Information
| Chemical Composition | Epoxy |
|---|---|
| Colour | Dark amber |
| Components | 3 |
| Elongation | 2.30% |
| Full Cure Time | 24 hrs / 3 days |
| Hardness | 70 D |
| Key Specifications | NASA Spec. MSFC-PROC-293, Amendment 1 |
| Mix Ratio | 100 X-81: 10 Activator A: 20 Flexible Resin #1 |
| Shear Strength Psi | 2050 |
| Specific Gravity | 1.21 |
| Tensile Strength | 6450 |
| Viscosity Cp | 5000 |
| Working Time | 6 min |