Typical Use Physical Properties Contact Us
Product Description
Bonding integrated circuit substrates; adhering lids and housings; attaching base plates and heat sinks.
Additional Information
| Colour | Clear |
|---|---|
| Components | 1 |
| Dielectric Strength | 500 |
| Flash Point | 101 C |
| Full Cure Time | 10 min @ 105 C |
| Hardness | 65 OO |
| Specific Gravity | 2.7 |
| Tensile Strength | 900 |
| Thermal Conductivity | 1.9 @ 77 F |
| Viscosity Cp | 58000 |
| Volume Resistivity | 2.20E+014 |