Typical Use Physical Properties Contact Us
Designed for bonding, potting and encapsulating electrical components which are sensitive to corrosion. Used in electronic applications, for component attachment to boards, housing assembly and potting.
|Dielectric Strength||550 Volts/Mil|
|Mix Ratio||1:1 by volume|
|Rt Tack Free Time||180 minutes|
|Tensile Strength||6,800 psi|