The form you request is not available now. Please try again later
Typical Use Physical Properties Contact Us
Product Description
Multi-Cure 9001-E-V3 series encapsulants display excellent adhesion to PC boards and electronic components and are especially well suited for chip on board, chip on flex, and multi-chip modules.
Additional Information
| Colour | Clear |
|---|---|
| Dielectric Strength | 500 |
| Elongation | 150.00% |
| Flash Point | >200F |
| Hardness | D45 |
| Tensile Strength | 750 |