Typical Use Physical Properties Contact Us
Product Description
Used for bonding, small potting, staking and laminating applications where optical clarity and excellent structural, mechanical, and electrical insulating properties are required; substrates include: glass, optical fibers, ceramics, metals and rigid plastic.
Additional Information
| Chemical Composition | Epoxy |
|---|---|
| Colour | Clear |
| Components | 2 |
| Dielectric Strength | 500 volts/mil |
| Elongation | 8.00% |
| Flash Point | >200 F |
| Full Cure Time | 5 hrs / 24 hrs |
| Hardness | 85 D |
| Shear Strength Psi | 4270 |
| Specific Gravity | 1.07 |
| Tensile Strength | 8000 |
| Viscosity Cp | 6000 |









