Typical Use Physical Properties Contact Us
Product Description
Bonding heat sinks to electronics devices; bonding printed circuit boards to substrates.
Additional Information
| Colour | Base: Red Curing Agent: Green |
|---|---|
| Components | 2 |
| Elongation | 130 percent |
| Full Cure Time | 24 hours @ 25 C |
| Hardness | 50A |
| Mix Ratio | 01:01:00 AM |
| Shear Strength Psi | 445 |
| Specific Gravity | 2.3 |
| Tensile Strength | 400 |
| Thermal Conductivity | 1.1 Watt/meter-K |
| Viscosity Cp | 5350 |
| Volume Resistivity | 7.20x 10(13) |
| Working Time | 4 hrs |