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Typical Use Physical Properties Contact Us
Product Description
Bonding integrated circuit substrates; adhering lids and housings; attaching base plates and heat sinks.
Additional Information
| Colour | Gray |
|---|---|
| Elongation | 20 percent |
| Flash Point | > 212 F |
| Hardness | 92 |
| Specific Gravity | 2.7 |
| Tensile Strength | 900 |
| Thermal Conductivity | 1.9 @ 77 F |
| Viscosity | 58000 |
| Volume Resistivity | 2.20E+014 |
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