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Typical Use Physical Properties Contact Us
Product Description
A silicone free compound applied under power transistors and other devices that generate heat to assist in transferring heat from generating objects to metal chassis for dissipation.
Additional Information
| Dielectric Strength | 200 volts/Mil |
|---|---|
| Specific Gravity | 2.7 @ 25°C per ASTM D70 test method |
| Thermal Conductivity | @ 36°C 16.7x10-4 CAL/SEC Cm C, Min. |
| Volume Resistivity | 2.3x10^12 OHMS/CM |