Dow Corning EE-3200 Low Stress Encapsulant Part B

SKU: 0002-01-000918

Dow Corning EE-3200 Low Stress Silicone Encapsulant is a two component, low viscosity encapsulant with a 1:1 mix ratio, good heat dissipation, and good thermal conductivity. Once thoroughly mixed, the mixture will cure to a flexible elastomer for the protection of electronic and electrical components. Part B, 0.5 kg Can.

Size: 0.5kg CanNormally ships within: 17 - 18 WeeksSold in quantity of: 1

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Weight 0.5 kg
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