Lord Circalok 6007

SKU: 0207-01-000073

LORD Circalok 6007 is a low viscosity ceramic filled epoxy resin offering excellent heat transfer, high voltage insulation, low exotherm and negligible shrinkage. The product is recommended as a thermally conductive, thin glue line adhesive for bonding semiconductors to heat sinks and as a low viscosity potting and casting product for any application where thermal conductivity and non-burning properties are required.

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