Additional information
| Manufacturer part no. | 9008/10SYMR |
|---|---|
| Size | 10g Syringe |
| Sold in quantity of | 1 |
| Normally ships within | 8 Weeks |
| Colour | Clear |
Dymax 9008 UV Curing Encapsulant – 10g Syringe
Dymax 9008 is engineered for chip encapsulation on flex circuits. The product cures upon exposure to UV/Visible light and is designed for rapid chip encapsulation in chip-on-board or chip-on-flex printed circuit board applications.
Dymax 9008 encapsulant forms flexible, highly moisture-resistant bonds to diverse surfaces such as polyimide (Kapton), DAP, glass, epoxy board, metal, and PET. 10g Syringe.
Features & Benefits:
- UV Curable flex circuit adhesive and encapsulant
- Cures with UV/Visible light
- Remains flexible at low temperatures (to -40C°)
- Low dielectric constant for high frequency applications
- Highly moisture resistant
- Low VOC
