Dymax 9008 UV Curing Encapsulant – 10g Syringe

SKU: 0114-01-001429

Dymax 9008 is engineered for chip encapsulation on flex circuits. The product cures upon exposure to UV/Visible light and is designed for rapid chip encapsulation in chip-on-board or chip-on-flex printed circuit board applications.

Dymax 9008 encapsulant forms flexible, highly moisture-resistant bonds to diverse surfaces such as polyimide (Kapton), DAP, glass, epoxy board, metal, and PET. 10g Syringe.

Features & Benefits:

  • UV Curable flex circuit adhesive and encapsulant
  • Cures with UV/Visible light
  • Remains flexible at low temperatures (to -40C°)
  • Low dielectric constant for high frequency applications
  • Highly moisture resistant
  • Low VOC

Normally ships within: Advised at point of enquiry


Additional information

Manufacturer part no.

9008/10SYMR
Size

10g Syringe
Sold in quantity of

Advised at point of enquiry
Normally ships within

Advised at point of enquiry
Colour

Clear

Dymax 9008 Product Data Sheet

Download

You may also like…