Dymax 9008 UV Curing Encapsulant – 10g Syringe

SKU: 0114-01-001429

Dymax 9008 is engineered for chip encapsulation on flex circuits. The product cures upon exposure to UV/Visible light and is designed for rapid chip encapsulation in chip-on-board or chip-on-flex printed circuit board applications.

Dymax 9008 encapsulant forms flexible, highly moisture-resistant bonds to diverse surfaces such as polyimide (Kapton), DAP, glass, epoxy board, metal, and PET. 10g Syringe.

Features & Benefits:

  • UV Curable flex circuit adhesive and encapsulant
  • Cures with UV/Visible light
  • Remains flexible at low temperatures (to -40C°)
  • Low dielectric constant for high frequency applications
  • Highly moisture resistant
  • Low VOC

Normally ships within: Advised at point of enquiry


Additional information

Manufacturer part no.

9008/10SYMR

Size

10g Syringe

Sold in quantity of

Advised at point of enquiry

Normally ships within

Advised at point of enquiry

Colour

Clear

Dymax 9008 Product Data Sheet

Download

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