Henkel Loctite ECCOBOND UF1173

ECCOBOND UF1173 is a one component, epoxy underfill which has been created for the next generation of high reliability electronics applications.

It is designed to provide a uniform and void-free encapsulating underfill which maximises a device's temperature cycling capability and dissipates stress away from solder joints and connections.

Loctite's new underfill is manufactured with health and safety as a key focus as it contains no reportable REACH SVCHS (as of June 2018) and is not CMR classified.

Other features include:

  • Fast curing
  • Can be needle or jet dispensed
  • Low coefficient of thermal expansion
  • High glass transition (Tg) temperature of 155?C
  • Provides interconnect protection from shock, drop and vibration
Available in two sizes: 10cc or 55cc

Size: N/a

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