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ECCOBOND UF1173 is a one component, epoxy underfill which has been created for the next generation of high reliability electronics applications.
It is designed to provide a uniform and void-free encapsulating underfill which maximises a device's temperature cycling capability and dissipates stress away from solder joints and connections.
Loctite's new underfill is manufactured with health and safety as a key focus as it contains no reportable REACH SVCHS (as of June 2018) and is not CMR classified.
Other features include: