Loctite ECCOBOND FP4460 – 10ML

SKU: 0006-01-000057

Loctite ECCOBOND FP4460 is an epoxy encapsulant that is designed for protection of bare semiconductor devices. Pressure pot performance on live devices is up to 500 hours with no failures, depending on device and package type. Typical applications include automotive applications, IC memory cards, chip carriers, hybrid circuits, multi-chip modules, BGA and pin grid arrays.

Please note, this product is frozen and must be shipped in dry ice. Contact us for more information.

Features & Benefits:

  • Black
  • High purity
  • Low stress
  • Improved work life
  • High temperature performance
  • Excellent chemical and moisture resistance
  • Heat cure

Size: 10ml

Normally ships within: Advised at point of enquirySold in quantity of: Advised at point of enquiry

Additional information

Manufacturer part no.




Sold in quantity of

Advised at point of enquiry

Normally ships within

Advised at point of enquiry



Loctite ECCOBOND FP4460 Technical Data Sheet


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