Loctite ECCOBOND FP4531 – 30cc

SKU: 0006-01-000052

Loctite ECCOBOND FP4531 is an epoxy-based underfill encapsulant for use on flip-chips on flex applications with gaps down to 1mm. This epoxy-based underfill encapsulant is formulated to flow easily into the small gaps on flex applications.

Loctite ECCOBOND FP4531 has a recommended snap-cure schedule of 7 minutes at 160°C and passes NASA outgassing standards.

Please note, this product is frozen and must be shipped in dry ice. Contact us for more information.

Features & Benefits:

  • Black
  • Snap curable
  • Fast flow
  • Passes NASA outgassing
  • Increasing reliability of a small-gap flip-chip
  • Heat cure

Size: 30cc

Normally ships within: Advised at point of enquirySold in quantity of: Advised at point of enquiry

Additional information

Manufacturer part no.




Sold in quantity of

Advised at point of enquiry

Normally ships within

Advised at point of enquiry



Loctite ECCOBOND FP4531 Technical Data Sheet


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